INNOVA supplies TO-220 ceramic insulators designed for installation between TO-220 packaged power transistors and the heatsink. The standard dimensions are 14 × 20 × 1 mm (0.55 × 0.79 × 0.04 in). Mounting hole diameters of 3.8 mm or 5 mm are available, while versions without holes or with customized hole designs can also be produced according to customer requirements. The products are typically packaged in 100 pieces per bag.
TO-220 Ceramic Insulator Cooling Pads are widely used in semiconductor devices, high-power equipment, integrated circuits, ICMOS tubes, IGBT insulation pads, triodes, high-frequency power supplies, communication equipment, and various mechanical systems. They are particularly suitable for applications involving high current, high voltage, elevated temperatures, and components requiring both electrical insulation and efficient heat dissipation.
Compared with conventional mica or silicone thermal pads, ceramic insulators offer clear advantages for MOSFET mounting, especially in high-frequency applications. Their high thermal conductivity and excellent electrical insulation help improve heat transfer efficiency while maintaining reliable electrical isolation. Common material options include 96% alumina (Al₂O₃) and aluminum nitride (AlN) ceramics.
TO-220 Ceramic Insulator Cooling Pads are also referred to as ceramic heat spreaders. They provide excellent resistance to high temperatures and mechanical pressure. The ceramic surfaces are smooth and burr-free, ensuring stable installation and uniform thermal contact. These insulators enable even heat distribution and rapid heat dissipation, while also offering good mechanical strength, resistance to acid and alkali corrosion, and long-term durability.
Below is a drawing of TO-220 ceramic insulators, as well as other customized TO-package ceramic insulators we can manufacture.
For more information about TO-series ceramic insulator thermal pads, please contact us.
