Aluminum nitride (AlN) ceramics are notable for their outstanding thermal conductivity, excellent electrical insulation, low dielectric constant and loss, and environmental safety. With a thermal expansion coefficient closely aligned to that of silicon, AlN has become a key substrate material for next-generation, highly integrated semiconductor devices. It not only serves as an ideal electronic packaging material but is also widely used in heat exchangers, piezoelectric components, thin films, and thermally conductive fillers.
Aluminum nitride ceramics have broad applications in copper-clad laminates, electronic packaging, ultra-high-temperature device housings, high-power and high-frequency device platforms, thin-film sensors, optoelectronic materials, and various coatings designed for functional performance enhancement.
Applications
1. Heat Dissipation Substrates and Electronic Packaging
AlN ceramics are an excellent choice for hybrid power switch packaging, microwave vacuum tube housings, and substrates used in large-scale integrated circuits, where superior heat management and insulation are critical.
2. Structural Ceramics
Thanks to their exceptional heat and corrosion resistance, AlN ceramics are used to manufacture crucibles, aluminum evaporation dishes, semiconductor electrostatic chucks, and other components operating in high-temperature and corrosive conditions.
3. Functional Materials
Aluminum nitride supports the development of high-frequency, high-power devices capable of stable operation under extreme temperatures or radiation. High-purity AlN ceramics are optically transparent, combining superior electrical and optical properties suitable for infrared optics, sensors, and multifunctional electronic devices.
4. Inert Heat-Resistant Materials
AlN maintains remarkable stability up to 2000 °C in non-oxidizing atmospheres, making it an ideal material for crucibles, protective tubes, and casting molds. Its resistance to molten metal corrosion also makes it an excellent refractory option for demanding thermal environments.
5. Heat Exchanger Components
With high thermal conductivity, low thermal expansion, and excellent resistance to thermal shock, AlN ceramics are ideal for use in heat exchangers, such as those in marine gas turbines, and in heat-resistant parts of internal combustion engines.
6. Filler Materials
Aluminum nitride’s combination of high thermal conductivity, electrical insulation, and compatibility with polymers makes it a preferred additive in electronic materials. It is widely applied in thermal interface materials (TIMs), flexible copper-clad laminates (FCCLs), and dielectric layers to enhance heat dissipation—effectively bridging thermal gaps between CPUs and heat sinks or between power transistors and substrates.
