In semiconductor fabrication, boron nitride (BN) serves as both an etching material and a source for thin film deposition. It acts as a protective layer, preventing contamination and damage to sensitive device components.
Additionally, boron nitride is widely used as an electron-beam evaporation source material to produce a variety of thin-film coatings.
For instance, conductive boron nitride crucibles (BN crucibles) are commonly employed in thin film deposition equipment for electron beam evaporation processes.
These crucibles are made from high-purity BN with a smooth surface finish, specifically engineered for electron beam evaporation applications.
They offer exceptional high-temperature resistance and superior thermal cycling performance, remaining chemically inert with most metals and ceramic rare-earth materials.
Even under rapid heating and cooling conditions, these crucibles maintain their structural integrity.
They are suitable for alloy melting, rare-earth and ceramic sintering, and electron beam evaporation coating processes.
Typical applications include thermal evaporation, high-frequency induction heating, electron beam coatings, aluminum deposition, and silicon plating.
Conductive BN crucibles provide high purity, excellent surface finish, and outstanding performance in electron beam evaporation, resulting in increased evaporation rates, faster material changeovers, improved thermal stability, and reduced power consumption—ultimately enhancing productivity and cost efficiency.
Key Advantages:
- Smooth film finish, high purity, minimal contamination, and long service life.
- Outstanding high-temperature and thermal cycling resistance, with low thermal expansion and minimal wetting from molten metals.
- Heat resistant up to 2000 °C; chemically stable with aluminum and non-volatile.
- Accelerated evaporation rates, reducing cycle times, and increasing overall yield.
- Rapid material change capability, minimizing downtime, and improving process efficiency.
- Enhanced thermal stability, ensuring consistent and controllable evaporation.
Technical Specifications:
- Main ingredients: BN + TiB₂
- Density: 3.0 g/cm³
- Binder: B₂O₃
- Color: Grey
- Room temperature resistivity: 300–2000 Ω·cm
- Maximum operating temperature: <1800 °C
- Thermal conductivity: >40 W/m·K
- Coefficient of thermal expansion: (4–6) × 10⁻⁶ K⁻¹
- Bending strength: >130 MPa
- Evaporation rate: 0.35–0.5 g/min·cm²
