3 Lead Ceramic Surface Mount Package for MEMS Devices - 10.2×7.5mm (SMD-0.5)
| Formula | Al₂O₃ | |
|---|---|---|
| Forms | ||
| Materials | ||
| Purity | 92% | |
| CAS Number | 1344-28-1 | |
| Commodity | Ceramic Package | |
| Model | SMD-0.5 | |
Product Properties
Downloads & Resources
| Resource Type | Link |
|---|---|
| Catalogue | Ceramic Packages |
Product Details
The SMD-0.5 Ceramic Surface Mount Package is a 3-lead hermetic ceramic package designed for high-reliability electronic packaging applications. Supplied as a complete set including a precision ceramic housing and matching ceramic lid, it provides excellent electrical insulation, reliable hermetic sealing, and stable thermal performance for demanding operating environments.
Featuring a large die attach area and precision ceramic construction, the SMD-0.5 package is suitable for microwave devices, RF modules, crystal resonators, crystal oscillators, and other electronic components requiring long-term reliability and efficient heat transfer.
| Item | Specification |
|---|---|
| Model | SMD-0.5 |
| Package Type | Ceramic Surface Mount Package |
| Lead Count | 3 |
| Die Cavity Size | 4.05 × 5.40 mm |
| Package Size | 10.2 × 7.5 × 3.02 mm |
| Lid Size | 10.07 × 7.43 × 0.25 mm |
| Sealing Type | Flat Seam Seal |
| Package Components | Ceramic Housing + Ceramic Lid |
Features
- Three-lead ceramic surface mount package
- Ceramic housing supplied with a matching ceramic lid
- Large die attach area for efficient thermal transfer
- Excellent current-carrying capability
- Reliable hermetic flat seam sealing
- High mechanical strength and electrical insulation
- Suitable for high-reliability electronic packaging
Applications
- Microwave device packages
- Crystal resonators
- Crystal oscillators
- RF electronic modules
- High-frequency electronic devices
Shipping & Customs
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Frequently Asked Questions
A Ceramic Surface Mount Package (SMD Package) is a hermetic electronic package consisting of a precision ceramic housing and matching ceramic lid. It is designed to protect semiconductor devices while providing excellent electrical insulation, thermal stability, and long-term reliability.
Compared with plastic packages, ceramic SMD packages offer superior hermetic sealing, excellent thermal conductivity, high electrical insulation, low thermal expansion, and reliable performance in harsh operating environments. They are widely used in high-frequency, high-power, and high-reliability electronic applications.
Ceramic SMD packages are commonly used for microwave devices, RF modules, crystal resonators, crystal oscillators, laser devices, sensors, optoelectronic components, and other high-reliability electronic assemblies.
Depending on the application requirements, ceramic surface mount packages can be manufactured from high-purity alumina (Al₂O₃), aluminum nitride (AlN), or other advanced ceramic materials to meet different thermal, electrical, and mechanical performance requirements.
Yes. Ceramic surface mount packages are typically supplied as a complete set consisting of a precision ceramic housing and a matching ceramic lid, ensuring accurate assembly and reliable hermetic sealing.
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