The Ultra Thin Aluminum Nitride (AlN) Ceramic Substrate Sheet is designed for advanced electronic applications requiring efficient thermal management and compact component integration. With a thickness of only 0.38 mm and a large format size of 138 × 190 mm, this substrate provides a lightweight solution for high-density electronic designs.
Product Properties
Downloads & Resources
| Resource Type | Link |
|---|---|
| Safety Data Sheet (SDS) | MSDS-AlＮ |
| Technical Data Sheet (TDS) | Properties of Aluminum Nitride Ceramic Substrates – SU0985 |
| Catalogue | Ceramic Substrates |
Product Details
The Ultra Thin Aluminum Nitride (AlN) Ceramic Substrate Sheet is designed for advanced electronic applications requiring efficient thermal management and compact component integration. With a thickness of only 0.38 mm and a large format size of 138 × 190 mm, this substrate provides a lightweight solution for high-density electronic designs.
The AlN ceramic material enables efficient heat transfer while maintaining electrical isolation, making it suitable for applications where both thermal performance and insulation reliability are required. The large-area substrate format also provides flexibility for circuit layout and subsequent processing.
This ultra-thin AlN ceramic substrate can be used as a base material for ceramic circuits, power electronic assemblies, and semiconductor packaging structures. Surface finishing, metallization compatibility, and custom dimensions can be provided according to specific application requirements.
Key Features
- Material: High-purity Aluminum Nitride (AlN) ceramic
- Thickness: 0.38 mm ultra-thin design
- Size: 138 × 190 mm
- Excellent electrical insulation
- Low thermal expansion coefficient
- Suitable for DPC, AMB, and ceramic circuit processing
- Custom sizes and specifications available
Shipping & Customs
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Frequently Asked Questions
Large size AlN ceramic substrates provide a larger mounting area for complex circuit layouts and high-density electronic assemblies while maintaining excellent thermal conductivity and electrical insulation performance.
Aluminum nitride offers much higher thermal conductivity than alumina while maintaining excellent electrical insulation and a thermal expansion coefficient close to silicon, making it suitable for high-power electronic applications.
Different thickness options are available according to application requirements, including thin and ultra-thin substrate designs for applications requiring compact structures and efficient thermal transfer.
Yes. The substrate can be processed for various ceramic metallization technologies, including DPC and AMB, depending on the customer’s circuit design and packaging requirements.
They are commonly used in power semiconductor modules, SiC and IGBT devices, automotive electronics, semiconductor packaging, RF components, and other applications requiring efficient thermal management.
Yes. Custom sizes, thicknesses, surface finishes, flatness requirements, and other processing specifications can be manufactured according to customer drawings or application needs.
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