INNOVASUPPLIES Ceramic Thermally Conductive Interface Pads are designed to provide a preferential heat-transfer path between heat-generating components, heat sinks, and other cooling devices. The pads are used to fill air gaps caused by imperfectly flat or smooth surfaces, which should be in thermal contact. The pads are made of ceramic materials such as alumina ceramic and aluminum nitride, which help in providing enhanced thermal conductivity and excellent insulation performance.
Product Properties
Downloads & Resources
| Resource Type | Link |
|---|---|
| Catalogue | Aluminum Nitride Ceramic Thermal Pads 250715 |
Product Details
INNOVASUPPLIES Ceramic Thermally Conductive Interface Pads are designed to provide a preferential heat-transfer path between heat-generating components, heat sinks, and other cooling devices. The pads are used to fill air gaps caused by imperfectly flat or smooth surfaces, which should be in thermal contact. The pads are made of ceramic materials such as alumina ceramic and aluminum nitride, which help in providing enhanced thermal conductivity and excellent insulation performance. Typical applications include Power Devices, Integrated Circuit (IC) chip packaging heat conduction, MOSFET Transistor, IGBT Transistor Heat Sink, MOS Transistor, heat sink interface, LED board Thermal Interface Material (TIM), Chip ON Film (COF) heat conduction.
Technical Specifications:
- Dimensions: 50.80 × 50.80 × 1.00 mm
- Thickness Tolerance: ±0.05 mm
- Length Tolerance: ±0.2 mm
- Surface Roughness: Ra ≤ 0.5 μm
- Flatness: ≤ 0.15 mm
Shipping & Customs
Your order may require payment of import duties or other customs clearance fees. Please check the notifications from the logistics company or relevant parties and complete the payment in time to prevent the shipment from being returned.
Frequently Asked Questions
The AlN ceramic pad provides a thermally conductive and electrically insulating interface between the power device and heat sink. It helps transfer heat away from the device while maintaining electrical isolation.
Yes. Aluminum nitride is an electrically insulating ceramic material, so the pad can provide electrical isolation while serving as a thermal path between the power device and heat sink.
Yes. The ceramic pad is designed to be positioned between the power device and heat sink. The mating surfaces should be clean and properly aligned, and the assembly should provide sufficient contact pressure for effective heat transfer.
Check the required length and width, pad thickness, mounting-hole configuration if applicable, device and heat-sink contact area, and the required electrical isolation. The replacement pad should match the mechanical and thermal requirements of the original assembly.
A controlled surface finish helps the ceramic pad make closer contact with the mating surfaces and can reduce unwanted air gaps at the thermal interface. This is particularly important when the pad is installed between a power device and heat sink.
Yes. In addition to the standard TO-258 configuration, custom dimensions, thicknesses, hole designs, and other configurations can be evaluated according to the power device and heat-sink assembly requirements.
Related products
Price range: $130.00 through $255.00
Original price was: $361.11.$325.00Current price is: $325.00.
Price range: $1,366.50 through $1,833.00
Original price was: $6.66.$6.00Current price is: $6.00.
My History
No products in history.