The CLCC16BC Ceramic Leadless Chip Carrier (CLCC) is a hermetic ceramic package designed for high-density surface-mount semiconductor packaging. Supplied as a complete set consisting of one ceramic housing, one ceramic lid, and four ceramic inserts, it provides excellent electrical insulation, thermal performance, and long-term reliability for integrated circuits and high-performance electronic devices.
Product Properties
Downloads & Resources
| Resource Type | Link |
|---|---|
| Catalogue | Ceramic Packages |
Product Details
The CLCC16BC Ceramic Leadless Chip Carrier (CLCC) is a hermetic ceramic package designed for high-density surface-mount semiconductor packaging. Supplied as a complete set consisting of one ceramic housing, one ceramic lid, and four ceramic inserts, it provides excellent electrical insulation, thermal performance, and long-term reliability for integrated circuits and high-performance electronic devices.
This package features 16 terminals with a 2.54 mm terminal pitch and a 3.6 × 5.4 mm chip cavity, making it suitable for die attachment and wire bonding. The leadless package design minimizes parasitic inductance and capacitance while reducing overall package size, making it ideal for compact electronic assemblies.
With a flat-seal structure, the CLCC package offers reliable hermetic sealing to protect sensitive semiconductor devices from moisture and environmental contamination. The ceramic construction also provides excellent heat dissipation, mechanical strength, and dimensional stability for demanding applications.
Custom lead counts, cavity dimensions, package sizes, metallization, and sealing configurations are available upon request.
Key Features
- 16-lead Ceramic Leadless Chip Carrier (CLCC16BC)
- Complete set including ceramic housing, ceramic lid, and four ceramic inserts
- Compact leadless package design
- Low parasitic inductance and capacitance
- Excellent thermal conductivity and electrical insulation
- High mechanical strength and dimensional stability
- Flat-seal hermetic package structure
- Suitable for die attach and wire bonding
- Custom designs available
Specifications
| Item | Specification |
|---|---|
| Package Type | Ceramic Leadless Chip Carrier (CLCC) |
| Model | CLCC16BC |
| Lead Count | 16 |
| Lead Pitch | 2.54 mm |
| Chip Cavity | 3.6 × 5.4 mm |
| Ceramic Body Size | 20 × 7.74 × 2.95 mm |
| Ceramic Lid Size | 19.45 × 6.85 × 0.25 mm |
| Ceramic Insert Size | 3.35 × 2 × 0.4 mm |
| Seal Type | Flat Seal |
| Package Components | 1 Ceramic Housing + 1 Ceramic Lid + 4 Ceramic Inserts |
Applications
- VLSI and ASIC devices
- ECL circuits
- High-density surface-mount electronic assemblies
- Semiconductor packaging
- High-reliability integrated circuits
- Industrial and communication electronics
Shipping & Customs
Your order may require payment of import duties or other customs clearance fees. Please check the notifications from the logistics company or relevant parties and complete the payment in time to prevent the shipment from being returned.
Frequently Asked Questions
Leadless ceramic packages reduce parasitic inductance and capacitance, making them better suited for high-speed, high-frequency, and high-density electronic applications while improving package compactness.
Yes. CLCC packages are specifically designed for surface-mount technology (SMT), allowing reliable soldering and efficient automated assembly.
Yes. The internal cavity is designed for semiconductor die attachment and wire bonding before hermetic sealing with the ceramic lid.
This package adopts a flat-seal design that provides reliable hermetic sealing, helping protect semiconductor devices from moisture, contamination, and harsh operating environments.
Yes. Cavity dimensions, terminal count, terminal pitch, metallization, and package configurations can all be customized to match specific chip designs and packaging requirements.
CLCC packages are commonly used for ASICs, VLSI devices, communication ICs, RF components, sensors, mixed-signal devices, and other high-reliability semiconductor applications.
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