This porous alumina ceramic plate is specifically designed for semiconductor vacuum chuck and air bearing applications.
With a uniform and controllable porous structure, it provides stable vacuum adsorption and evenly distributed airflow, enabling non-contact and damage-free handling of wafers, glass panels, and thin substrates.
It is ideal for high-precision, high-cleanliness manufacturing environments such as semiconductor and flat panel display processing.
Product Properties
Downloads & Resources
| Resource Type | Link |
|---|---|
| Catalogue | Porous_Ceramics |
Product Details
This porous alumina ceramic plate is specifically designed for semiconductor vacuum chuck and air bearing applications.
With a uniform and controllable porous structure, it provides stable vacuum adsorption and evenly distributed airflow, enabling non-contact and damage-free handling of wafers, glass panels, and thin substrates.
It is ideal for high-precision, high-cleanliness manufacturing environments such as semiconductor and flat panel display processing.
Typical Applications
Vacuum Chuck Systems
- Wafer grinding vacuum chuck
- Wafer dicing vacuum chuck
- Wafer transfer and handling systems
- Printing and coating vacuum platforms
Air Bearing / Air Floating Systems
- Precision air bearing platforms
- Non-contact air floating transport systems
- Glass and panel handling systems
Other Applications
- Semiconductor wafer processing
- LCD & OLED display manufacturing
- Thin film and laser processing platforms
- Photovoltaic and solar cell production
Key Features
- Uniform and controllable porous structure
- Stable and reliable vacuum adsorption performance
- Even airflow distribution for air floating applications
- High air permeability and low pressure loss
- Excellent flatness and dimensional consistency
- Suitable for ultra-clean and precision manufacturing environments
- Large-format available for wafer and panel applications
Frequently Asked Questions
The plate is made of porous alumina ceramic, known for its durability and precision.
It is commonly used in vacuum chuck systems, air bearing platforms, and wafer handling systems in semiconductor and flat panel display manufacturing.
Yes, it is ideal for ultra-clean and precision manufacturing environments.
Key features include a uniform porous structure, stable vacuum adsorption, even airflow distribution, and excellent flatness.
Yes, it provides even airflow distribution, making it suitable for air floating and non-contact transport systems.
The plate offers high air permeability and low pressure loss for optimal performance.
Yes, large-format options are available to accommodate wafer and panel applications.
Industries such as semiconductor manufacturing, LCD and OLED production, and photovoltaic cell manufacturing benefit from this product.
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