The Thin Aluminum Nitride (AlN) Ceramic Substrate Sheet is a large-format ceramic substrate developed for electronic packaging and thermal management applications. Featuring a 0.635 mm thickness and 138 × 190 mm dimensions, it provides a balance between thermal performance, mechanical strength, and handling reliability.
Product Properties
Downloads & Resources
| Resource Type | Link |
|---|---|
| Safety Data Sheet (SDS) | MSDS-AlＮ |
| Technical Data Sheet (TDS) | Properties of Aluminum Nitride Ceramic Substrates – SU0985 |
| Catalogue | Ceramic Substrates |
Product Details
The Thin Aluminum Nitride (AlN) Ceramic Substrate Sheet is a large-format ceramic substrate developed for electronic packaging and thermal management applications. Featuring a 0.635 mm thickness and 138 × 190 mm dimensions, it provides a balance between thermal performance, mechanical strength, and handling reliability.
Compared with ultra-thin ceramic substrates, the 0.635 mm thickness offers improved structural stability during processing and assembly while maintaining the excellent thermal characteristics of aluminum nitride. It is suitable for applications requiring a larger mounting area and reliable long-term operation.
The substrate can be further processed for metallization, circuit fabrication, or customized ceramic packaging solutions. Different surface finishes, dimensions, and processing requirements are available upon request.
Key Features
- Material: Aluminum Nitride (AlN) ceramic
- Thickness: 0.635 mm
- Size: 138 × 190 mm
- High electrical insulation performance
- Good mechanical stability
- Suitable for power electronics and semiconductor packaging
- Compatible with ceramic metallization processes
- Custom processing available
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Frequently Asked Questions
Large size AlN ceramic substrates provide a larger mounting area for complex circuit layouts and high-density electronic assemblies while maintaining excellent thermal conductivity and electrical insulation performance.
Aluminum nitride offers much higher thermal conductivity than alumina while maintaining excellent electrical insulation and a thermal expansion coefficient close to silicon, making it suitable for high-power electronic applications.
Different thickness options are available according to application requirements, including thin and ultra-thin substrate designs for applications requiring compact structures and efficient thermal transfer.
Yes. The substrate can be processed for various ceramic metallization technologies, including DPC and AMB, depending on the customer’s circuit design and packaging requirements.
They are commonly used in power semiconductor modules, SiC and IGBT devices, automotive electronics, semiconductor packaging, RF components, and other applications requiring efficient thermal management.
Yes. Custom sizes, thicknesses, surface finishes, flatness requirements, and other processing specifications can be manufactured according to customer drawings or application needs.
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