This compact Aluminum Nitride (AlN) ceramic substrate is designed for miniaturized high-power electronic devices, combining the functions of a substrate, heat sink, and heat spreader in a single ceramic component. With a size of 25×20×1.0 mm, it is widely used in automotive LED modules, industrial lighting systems, and compact optical communication devices. Its high thermal conductivity of 170–230 W/m·K ensures efficient heat dissipation in space-constrained applications.
Product Properties
Downloads & Resources
| Resource Type | Link |
|---|---|
| Safety Data Sheet (SDS) | MSDS-AlＮ |
| Technical Data Sheet (TDS) | Properties of Aluminum Nitride Ceramic Substrates – SU0985 |
Product Details
This compact Aluminum Nitride (AlN) ceramic substrate is designed for miniaturized high-power electronic devices, combining the functions of a substrate, heat sink, and heat spreader in a single ceramic component.
With a size of 25×20×1.0 mm, it is widely used in automotive LED modules, industrial lighting systems, and compact optical communication devices. Its high thermal conductivity of 170–230 W/m·K ensures efficient heat dissipation in space-constrained applications.
The precision-ground surface with Ra ≤ 0.5 μm enables stable chip mounting and high-yield metallization processes. It is compatible with both DPC and AMB technologies, ensuring strong performance in advanced electronic packaging.
Key Features
- Compact AlN ceramic heat sink substrate
- Thermal conductivity 170–230 W/m·K
- Excellent electrical insulation performance
- Precision surface finish Ra ≤ 0.5 μm
- Compatible with DPC and AMB processes
- High reliability for compact electronic systems
Applications
- Automotive LED modules
- Industrial LED lighting
- Compact optical communication modules
- Miniaturized power electronic devices
Frequently Asked Questions
AlN ceramic substrates are used for high-power electronic packaging, providing both electrical insulation and efficient thermal management in power modules, RF devices, and LED applications.
AlN offers much higher thermal conductivity (170–230 W/m·K) than alumina, making it more suitable for high-power density and high-heat dissipation applications.
Yes, AlN ceramics are widely used as heat sinks and heat spreaders due to their excellent thermal conductivity and electrical insulation properties.
DPC (Direct Plated Copper) and AMB (Active Metal Brazing) are metallization processes used to form conductive layers on ceramic substrates. AlN is compatible with both technologies.
High surface flatness ensures reliable chip bonding, uniform metallization, and improved yield in power and high-frequency electronic packaging.
They are widely used in power electronics, automotive electronics, RF power amplifiers, LED lighting, and optical communication modules.
Yes, AlN ceramics have excellent thermal stability and can maintain performance under high-temperature operating conditions.
Yes, they can be customized in size, thickness, surface finish, and metallization requirements based on application needs.
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