The Aluminum Nitride (AlN) Ceramic Substrate Sheet is a high-performance ceramic substrate designed for electronic and thermal management applications requiring excellent heat dissipation and electrical insulation. Made from aluminum nitride ceramic, this substrate combines high thermal conductivity with outstanding electrical insulation properties, making it suitable for applications where efficient heat transfer and reliable electrical isolation are required.
Product Properties
Downloads & Resources
| Resource Type | Link |
|---|---|
| Safety Data Sheet (SDS) | MSDS-AlＮ |
| Technical Data Sheet (TDS) | Properties of Aluminum Nitride Ceramic Substrates – SU0985 |
Product Details
The Aluminum Nitride (AlN) Ceramic Substrate Sheet is a high-performance ceramic substrate designed for electronic and thermal management applications requiring excellent heat dissipation and electrical insulation.
Made from aluminum nitride ceramic, this substrate combines high thermal conductivity with outstanding electrical insulation properties, making it suitable for applications where efficient heat transfer and reliable electrical isolation are required.
With a size of 37 × 26 × 0.5 mm, the AlN ceramic substrate provides a compact and precise platform for power electronics, semiconductor packaging, and thermal management components. The thin ceramic structure helps optimize space utilization while maintaining stable mechanical performance.
This product is supplied in a 200-piece package, making it suitable for prototyping, production runs, and batch manufacturing requirements.
Custom sizes, thicknesses, surface finishes, and metallization options are available according to customer requirements.
Key Features
- High thermal conductivity aluminum nitride ceramic
- Excellent electrical insulation performance
- Compact 37 × 26 × 0.5 mm substrate size
- Suitable for power electronics and semiconductor applications
- Stable mechanical and thermal performance
- Available in bulk packaging (200 pcs)
- Custom dimensions and specifications available
Shipping & Customs
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Frequently Asked Questions
AlN ceramic substrates are used for high-power electronic packaging, providing both electrical insulation and efficient thermal management in power modules, RF devices, and LED applications.
AlN offers much higher thermal conductivity (170–230 W/m·K) than alumina, making it more suitable for high-power density and high-heat dissipation applications.
Yes, AlN ceramics are widely used as heat sinks and heat spreaders due to their excellent thermal conductivity and electrical insulation properties.
DPC (Direct Plated Copper) and AMB (Active Metal Brazing) are metallization processes used to form conductive layers on ceramic substrates. AlN is compatible with both technologies.
High surface flatness ensures reliable chip bonding, uniform metallization, and improved yield in power and high-frequency electronic packaging.
They are widely used in power electronics, automotive electronics, RF power amplifiers, LED lighting, and optical communication modules.
Yes, AlN ceramics have excellent thermal stability and can maintain performance under high-temperature operating conditions.
Yes, they can be customized in size, thickness, surface finish, and metallization requirements based on application needs.
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