This Aluminum Nitride (AlN) ceramic component functions as both a high-performance electronic substrate and a thermal management heat sink for power electronic systems. Designed in a 37×26×1.0 mm format, it is widely used in IGBT modules, automotive onboard chargers (OBC), and large optical communication modules.
Product Properties
Downloads & Resources
| Resource Type | Link |
|---|---|
| Safety Data Sheet (SDS) | MSDS-AlＮ |
| Technical Data Sheet (TDS) | Properties of Aluminum Nitride Ceramic Substrates – SU0985 |
Product Details
This Aluminum Nitride (AlN) ceramic component functions as both a high-performance electronic substrate and a thermal management heat sink for power electronic systems. Designed in a 37×26×1.0 mm format, it is widely used in IGBT modules, automotive onboard chargers (OBC), and large optical communication modules.
With ultra-high thermal conductivity of 170–230 W/m·K, this AlN ceramic efficiently dissipates heat from high-power devices while maintaining excellent electrical insulation. It also acts as an effective heat spreader, reducing localized thermal stress and improving system reliability.
The surface is precision-processed to Ra ≤ 0.5 μm, ensuring excellent flatness for die attachment. It is fully compatible with DPC and AMB metallization technologies and supports advanced power packaging structures.
Key Features
- AlN ceramic substrate and heat sink integrated function
- High thermal conductivity 170–230 W/m·K
- Excellent electrical insulation and thermal shock resistance
- Precision surface Ra ≤ 0.5 μm
- Compatible with DPC and AMB processes
- High reliability for power cycling environments
Applications
- IGBT power modules
- EV onboard chargers
- High-power electronic packaging
- Large optical communication modules
Shipping & Customs
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Frequently Asked Questions
AlN ceramic substrates are used for high-power electronic packaging, providing both electrical insulation and efficient thermal management in power modules, RF devices, and LED applications.
AlN offers much higher thermal conductivity (170–230 W/m·K) than alumina, making it more suitable for high-power density and high-heat dissipation applications.
Yes, AlN ceramics are widely used as heat sinks and heat spreaders due to their excellent thermal conductivity and electrical insulation properties.
DPC (Direct Plated Copper) and AMB (Active Metal Brazing) are metallization processes used to form conductive layers on ceramic substrates. AlN is compatible with both technologies.
High surface flatness ensures reliable chip bonding, uniform metallization, and improved yield in power and high-frequency electronic packaging.
They are widely used in power electronics, automotive electronics, RF power amplifiers, LED lighting, and optical communication modules.
Yes, AlN ceramics have excellent thermal stability and can maintain performance under high-temperature operating conditions.
Yes, they can be customized in size, thickness, surface finish, and metallization requirements based on application needs.
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