The Aluminum Nitride (AlN) Ceramic Plate is a compact ceramic component designed for applications requiring reliable electrical insulation, thermal management, and thermal stability. Made from aluminum nitride ceramic, it combines high thermal conductivity with excellent electrical insulation and good thermal stability. With a compact size of 10 × 6 × 2 mm, this small rectangular ceramic plate is suitable for space-constrained assemblies and applications requiring a precision AlN ceramic component.
Product Properties
Downloads & Resources
| Resource Type | Link |
|---|---|
| Safety Data Sheet (SDS) | MSDS-AlＮ |
| Technical Data Sheet (TDS) | Properties of Aluminum Nitride Ceramic Substrates – SU0985 |
Product Details
The Aluminum Nitride (AlN) Ceramic Plate is a compact ceramic component designed for applications requiring reliable electrical insulation, thermal management, and thermal stability.
Made from aluminum nitride ceramic, it combines high thermal conductivity with excellent electrical insulation and good thermal stability. With a compact size of 10 × 6 × 2 mm, this small rectangular ceramic plate is suitable for space-constrained assemblies and applications requiring a precision AlN ceramic component.
The plate can be used as an insulating or heat-dissipating ceramic element in electronic and thermal management applications. Custom dimensions, thicknesses, surface finishes, and other specifications are available according to specific application requirements.
| Item | Specification |
|---|---|
| Material | Aluminum Nitride (AlN) Ceramic |
| Shape | Rectangular Plate |
| Length | 10 mm |
| Width | 6 mm |
| Thickness | 2 mm |
| Package Quantity | 100 pcs |
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Frequently Asked Questions
AlN ceramic substrates are used for high-power electronic packaging, providing both electrical insulation and efficient thermal management in power modules, RF devices, and LED applications.
AlN offers much higher thermal conductivity (170–230 W/m·K) than alumina, making it more suitable for high-power density and high-heat dissipation applications.
Yes, AlN ceramics are widely used as heat sinks and heat spreaders due to their excellent thermal conductivity and electrical insulation properties.
DPC (Direct Plated Copper) and AMB (Active Metal Brazing) are metallization processes used to form conductive layers on ceramic substrates. AlN is compatible with both technologies.
High surface flatness ensures reliable chip bonding, uniform metallization, and improved yield in power and high-frequency electronic packaging.
They are widely used in power electronics, automotive electronics, RF power amplifiers, LED lighting, and optical communication modules.
Yes, AlN ceramics have excellent thermal stability and can maintain performance under high-temperature operating conditions.
Yes, they can be customized in size, thickness, surface finish, and metallization requirements based on application needs.
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