The Aluminum Nitride (AlN) Ceramic Substrate is a precision ceramic substrate designed for electronic, thermal management, and semiconductor applications requiring efficient heat dissipation and electrical insulation. Made from aluminum nitride ceramic, the substrate combines high thermal conductivity with excellent electrical insulation. Its 60 × 48 × 0.5 mm format provides a relatively large working area while maintaining a thin ceramic profile for space-sensitive applications.
Product Properties
Downloads & Resources
| Resource Type | Link |
|---|---|
| Safety Data Sheet (SDS) | MSDS-AlＮ |
| Technical Data Sheet (TDS) | Properties of Aluminum Nitride Ceramic Substrates – SU0985 |
Product Details
The Aluminum Nitride (AlN) Ceramic Substrate is a precision ceramic substrate designed for electronic, thermal management, and semiconductor applications requiring efficient heat dissipation and electrical insulation.
Made from aluminum nitride ceramic, the substrate combines high thermal conductivity with excellent electrical insulation. Its 60 × 48 × 0.5 mm format provides a relatively large working area while maintaining a thin ceramic profile for space-sensitive applications.
Both sides of the substrate are precision ground, with a surface roughness of Ra 0.2–0.75 μm. The double-sided grinding process helps provide consistent and controlled surface conditions for applications where substrate surface quality and dimensional consistency are important.
The substrates are supplied in 100-piece batches, making them suitable for prototyping, laboratory evaluation, and batch production. Custom dimensions, thicknesses, surface finishes, and other specifications can be provided according to application requirements.
| Item | Specification |
|---|---|
| Material | Aluminum Nitride (AlN) Ceramic |
| Shape | Square / Rectangular Sheet |
| Size | 60 × 48 × 0.5 mm |
| Surface Processing | Double-Sided Grinding |
| Surface Roughness | Ra 0.2–0.75 μm |
| Package Quantity | 100 pcs |
Shipping & Customs
Your order may require payment of import duties or other customs clearance fees. Please check the notifications from the logistics company or relevant parties and complete the payment in time to prevent the shipment from being returned.
Frequently Asked Questions
AlN ceramic substrates are used for high-power electronic packaging, providing both electrical insulation and efficient thermal management in power modules, RF devices, and LED applications.
AlN offers much higher thermal conductivity (170–230 W/m·K) than alumina, making it more suitable for high-power density and high-heat dissipation applications.
Yes, AlN ceramics are widely used as heat sinks and heat spreaders due to their excellent thermal conductivity and electrical insulation properties.
DPC (Direct Plated Copper) and AMB (Active Metal Brazing) are metallization processes used to form conductive layers on ceramic substrates. AlN is compatible with both technologies.
High surface flatness ensures reliable chip bonding, uniform metallization, and improved yield in power and high-frequency electronic packaging.
They are widely used in power electronics, automotive electronics, RF power amplifiers, LED lighting, and optical communication modules.
Yes, AlN ceramics have excellent thermal stability and can maintain performance under high-temperature operating conditions.
Yes, they can be customized in size, thickness, surface finish, and metallization requirements based on application needs.
Related products
$15.00
Price range: $1,366.50 through $1,833.00
Original price was: $555.55.$500.00Current price is: $500.00.
$25.00
My History
No products in history.