This high-performance Aluminum Nitride (AlN) ceramic substrate is designed for advanced high-frequency and high-speed electronic systems. It serves as both a ceramic substrate and thermal management heat sink for 800G and 1.6T optical communication modules, as well as RF power amplifiers.
Product Properties
Downloads & Resources
| Resource Type | Link |
|---|---|
| Safety Data Sheet (SDS) | MSDS-AlＮ |
| Technical Data Sheet (TDS) | Properties of Aluminum Nitride Ceramic Substrates – SU0985 |
Product Details
This high-performance Aluminum Nitride (AlN) ceramic substrate is designed for advanced high-frequency and high-speed electronic systems. It serves as both a ceramic substrate and thermal management heat sink for 800G and 1.6T optical communication modules, as well as RF power amplifiers.
The material offers thermal conductivity up to 230 W/m·K, enabling efficient heat dissipation in compact high-density packages. As a ceramic heat spreader, it reduces thermal hotspots and improves signal stability in high-frequency applications.
The substrate features a highly polished surface with Ra ≤ 0.5 μm, ensuring excellent metallization quality and die bonding reliability. It supports both DPC and AMB processes, making it suitable for advanced semiconductor packaging.
Key Features
- AlN ceramic substrate with heat sink functionality
- High thermal conductivity 170–230 W/m·K
- Ultra-smooth surface Ra ≤ 0.5 μm
- Suitable for high-frequency and high-speed electronics
- Compatible with DPC and AMB metallization
- Excellent thermal stability and electrical insulation
Applications
- 800G / 1.6T optical communication modules
- RF power amplifiers
- High-speed semiconductor devices
- Advanced packaging systems
Shipping & Customs
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Frequently Asked Questions
AlN ceramic substrates are used for high-power electronic packaging, providing both electrical insulation and efficient thermal management in power modules, RF devices, and LED applications.
AlN offers much higher thermal conductivity (170–230 W/m·K) than alumina, making it more suitable for high-power density and high-heat dissipation applications.
Yes, AlN ceramics are widely used as heat sinks and heat spreaders due to their excellent thermal conductivity and electrical insulation properties.
DPC (Direct Plated Copper) and AMB (Active Metal Brazing) are metallization processes used to form conductive layers on ceramic substrates. AlN is compatible with both technologies.
High surface flatness ensures reliable chip bonding, uniform metallization, and improved yield in power and high-frequency electronic packaging.
They are widely used in power electronics, automotive electronics, RF power amplifiers, LED lighting, and optical communication modules.
Yes, AlN ceramics have excellent thermal stability and can maintain performance under high-temperature operating conditions.
Yes, they can be customized in size, thickness, surface finish, and metallization requirements based on application needs.
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