96% Alumina Ceramic Substrate (Al₂O₃) is a high-performance ceramic base material designed for power electronic circuits and ceramic printed circuit board (PCB) applications. With excellent thermal conductivity, electrical insulation, and mechanical strength, it is widely used as a reliable substrate for electronic packaging and circuit integration. This substrate features a double-sided polished surface, achieving high flatness and smoothness to ensure stable thin-film deposition, metallization, and circuit printing processes. The precision-ground surface improves adhesion performance and supports high-reliability electronic manufacturing.
Product Properties
Downloads & Resources
| Resource Type | Link |
|---|---|
| Safety Data Sheet (SDS) | 96% Alumina MSDS-Innovacera |
| Technical Data Sheet (TDS) | 96% Alumina Ceramic Material Properties-SU0627 |
Product Details
96% Alumina Ceramic Substrate (Al₂O₃) is a high-performance ceramic base material designed for power electronic circuits and ceramic printed circuit board (PCB) applications. With excellent thermal conductivity, electrical insulation, and mechanical strength, it is widely used as a reliable substrate for electronic packaging and circuit integration.
This substrate features a double-sided polished surface, achieving high flatness and smoothness to ensure stable thin-film deposition, metallization, and circuit printing processes. The precision-ground surface improves adhesion performance and supports high-reliability electronic manufacturing.
Key Features
- 96% high-purity alumina ceramic material
- Double-sided polished (precision ground surface)
- Excellent electrical insulation properties
- Good thermal conductivity for power applications
- High mechanical strength and dimensional stability
- Suitable for thin-film and thick-film processes
Applications
- Power electronic ceramic PCB substrates
- DBC/DBC-like circuit base plates
- IGBT module substrates (non-DBC structure support)
- Hybrid circuit and thick-film circuits
- High-power LED and power modules
- Electronic packaging and insulation layers
Specification
- Material: 96% Al₂O₃ (Alumina)
- Size: 60 × 48 × 1 mm
- Surface: Double-sided polished (ground finish)
- Type: Ceramic substrate/base plate
Custom Service
Custom sizes, thicknesses, surface roughness levels, and metallization-ready grades are available according to customer requirements.
Shipping & Customs
Your order may require payment of import duties or other customs clearance fees. Please check the notifications from the logistics company or relevant parties and complete the payment in time to prevent the shipment from being returned.
Frequently Asked Questions
Double-side polishing improves flatness and surface uniformity, which is critical for thin-film deposition, metallization, and reliable circuit printing in power electronic applications.
The substrate can achieve a high-precision polished surface with controlled roughness suitable for thick-film and thin-film circuit processes.
Poor flatness can lead to uneven metallization, weak adhesion, and reliability issues in power electronic circuits, especially under thermal cycling conditions.
Yes, after proper polishing and cleaning, alumina substrates are suitable for thick-film or thin-film printing processes used in ceramic PCBs.
Alumina offers lower cost and excellent insulation, while aluminum nitride provides significantly higher thermal conductivity for high-power heat dissipation applications.
Warping is usually caused by uneven thickness, improper firing conditions, or thermal stress during processing and high-temperature cycling.
Alumina remains widely used due to its stability, mature processing technology, cost advantage, and reliable electrical insulation performance.
Yes, alumina substrates can be supplied with controlled surface finish and dimensions suitable for metallization or hybrid circuit structures.
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