DIP40 CDIP dual-in-line ceramic package equipped with 40 pins and 0.8mm lead spacing. Fixed outer ceramic body and chip cavity sizes, an airtight ceramic packaging solution for IC, optocoupler, and MEMS chip encapsulation.
Product Properties
Downloads & Resources
| Resource Type | Link |
|---|---|
| Catalogue | Ceramic Packages |
Product Details
The DIP40 Ceramic Dual In-line Package (CDIP) is a hermetic ceramic packaging carrier designed for semiconductor chips, optocouplers and MEMS components.
This product is supplied as a complete set consisting of a ceramic housing and a matching ceramic cover plate.
Core dimension specs of this model:
- Pin count: 40 pins
- Lead pitch: 0.8mm
- Outer ceramic body size: 50.8 × 15.5 mm
- Internal chip cavity dimension: 10.2 × 10.2 mm
- Ceramic cover plate dimension: 12.6 ×12.6 ×0.1 mm
This integrated ceramic enclosure provides airtight sealing, excellent electrical insulation and stable high-temperature performance for long-term chip packaging.
Key Features
- Standard dual-in-line pin layout, compatible with common PCB through-hole welding and assembly
- Diverse optional pin count options to match different circuit layout requirements
- Monolithic all-ceramic airtight structure, with great moisture, corrosion and heat resistance
- Rigid ceramic framework ensures stable mechanical performance in complex working environments
Application Fields
- Ideal for electronic components with low to medium assembly density demands:
- Conventional integrated circuits
- Optocoupler and optical isolation devices
- MEMS micro-electromechanical sensors
- High-reliability electronic modules for industrial control and automotive industries
Shipping & Customs
Your order may require payment of import duties or other customs clearance fees. Please check the notifications from the logistics company or relevant parties and complete the payment in time to prevent the shipment from being returned.
Frequently Asked Questions
A Ceramic Dual In-line Package (CDIP) is a hermetic semiconductor package consisting of a ceramic body, metal leads, and a matching ceramic lid. It is designed to provide reliable protection for integrated circuits and other sensitive electronic devices.
The package is suitable for integrated circuits (ICs), optocouplers, MEMS devices, sensors, analog and mixed-signal components, and other electronic devices requiring high reliability and hermetic sealing.
Yes. This product is supplied as a complete set, including the ceramic package body and a matching ceramic cover plate.
Yes. The ceramic package is designed for hermetic sealing using appropriate sealing processes, helping protect semiconductor devices from moisture, contaminants, and harsh operating environments.
Yes. Different pin counts, package sizes, cavity dimensions, lead configurations, and other specifications can be customized according to customer requirements.
Ceramic packages provide better hermeticity, higher temperature resistance, superior electrical insulation, and improved long-term reliability, making them suitable for demanding industrial and high-reliability electronic applications.
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