The Ceramic Small Outline Package (CSOP) is a hermetic ceramic package designed for high-reliability semiconductor and integrated circuit packaging. The package consists of a precision ceramic housing and a matching ceramic lid, providing excellent electrical insulation, mechanical strength, and long-term environmental protection for sensitive electronic devices.
Product Properties
Downloads & Resources
| Resource Type | Link |
|---|---|
| Catalogue | Ceramic Packages |
Product Details
The Ceramic Small Outline Package (CSOP) is a hermetic ceramic package designed for high-reliability semiconductor and integrated circuit packaging. The package consists of a precision ceramic housing and a matching ceramic lid, providing excellent electrical insulation, mechanical strength, and long-term environmental protection for sensitive electronic devices.
The ceramic package incorporates a 6.00 × 4.00 mm chip cavity, allowing secure die attachment and wire bonding for various integrated circuits and electronic components.
Custom package dimensions, cavity sizes, lead configurations, metallization, and sealing options are available upon request.
Key Features
- 20-lead ceramic small outline package (CSOP20)
- Precision ceramic housing with matching ceramic lid
- Hermetic flat-seal package design
- Standard 1.27 mm lead pitch
- Compact surface-mount package
- Excellent electrical insulation
- High mechanical strength
- Good resistance to mechanical impact
- Suitable for die attach and wire bonding
- Custom configurations available
Specifications
| Item | Specification |
|---|---|
| Package Type | Ceramic Small Outline Package (CSOP) |
| Model | CSOP20-01 |
| Lead Count | 20 |
| Lead Pitch | 1.27 mm |
| Chip Cavity | 6.00 × 4.00 mm |
| Ceramic Body Size | 12.70 × 15.50 × 2.75 mm |
| Ceramic Lid Size | 11.90 × 7.10 × 0.11 mm |
| Seal Type | Flat Seal |
| Package Components | Ceramic Housing + Ceramic Lid |
Applications
- Integrated circuits (ICs)
- Analog and mixed-signal devices
- High-reliability electronic modules
- Industrial electronics
- Automotive electronics
- Medical electronic devices
- Optical communication components
Shipping & Customs
Your order may require payment of import duties or other customs clearance fees. Please check the notifications from the logistics company or relevant parties and complete the payment in time to prevent the shipment from being returned.
Frequently Asked Questions
A Ceramic Small Outline Package (CSOP) is a hermetic surface-mount ceramic package designed for integrated circuits and other high-reliability semiconductor devices. It combines excellent electrical insulation, mechanical strength, and environmental protection in a compact footprint.
The package is supplied as a complete set consisting of a precision ceramic housing and a matching ceramic lid, ready for die attachment, wire bonding, and subsequent hermetic sealing.
CSOP ceramic packages are typically designed for flat-seal hermetic packaging. Depending on the application and package design, other sealing technologies may also be available upon request.
Yes. Lead count, lead pitch, cavity dimensions, package size, metallization, and other structural parameters can be customized to meet specific semiconductor packaging requirements.
They are widely used for integrated circuits, analog and mixed-signal devices, sensors, optoelectronic components, and other high-reliability electronic modules requiring hermetic protection.
Ceramic packages provide superior hermeticity, excellent electrical insulation, high-temperature stability, and long-term reliability, making them ideal for demanding industrial, medical, automotive, and semiconductor applications.
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